| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 74HC154PW | IC |
NXP/恩智浦 |
TSSOP-24 |
1505+ |
342 |
|||
| CY7C68300C-56PVXC | 接口IC |
CYPRESS/赛普拉斯 |
SSOP56 |
0631+ |
9 |
|||
| WL816EC-DS2-7H | FOXCONN/富士康 |
SMD |
2012+ |
38 |
||||
| MAX232EPE | 接口IC |
MAXIM/美信 |
DIP-16 |
09+ |
340 |
|||
| 74LVC1G08GV-Q100 | IC |
NEXPERIA/安世 |
SC-74A-5 |
2352+ |
920 |
|||
| S25FL064P0XMFI001 | IC |
SPANSION/飞索半导体 |
SOP16 |
17+ |
312 |
|||
| BSC9132NXE7MNMB | NXP/恩智浦 |
BGA780 |
17+ |
466 |
||||
| JL82599ESSR1VM | INTEL/英特尔 |
BGA |
1807+ |
48 |
||||
| MCP2517FD-H/JHA | IC |
MICROCHIP/微芯 |
VDFN14 |
2021+ |
270 |
|||
| MCP2518FDT-H/QBB | IC |
MICROCHIP/微芯 |
VDFN-14 |
23+ |
153 |
|||
| 88E6063C1-RCJ1C000 | MARVELL/迈威 |
QFP128 |
0952+ |
53 |
||||
| CN6130-800BG868-AAP-G | CAVIUM |
BGA |
18+ |
75 |
||||
| XC3S400A-FGG400AGQ | XILINX/赛灵思 |
BGA |
0905+ |
2 |
||||
| MAX25L6445EM2I-10G | MXIC/旺宏 |
SOP-8 |
1933+ |
91 |
||||
| EG1000A | EG/屹晶微 |
ESOP-8 |
1713+ |
3045 |
||||
| 88X3310-A1-BUS4I000 | MARVELL/迈威 |
BGA168 |
21+ |
106 |
||||
| MCP1703T-2502E | IC |
MICROCHIP/微芯 |
SOT-23 |
22+ |
4020 |
|||
| MCP2517FD-H/JHA | IC |
MICROCHIP/微芯 |
VDFN14 |
21+ |
153 |
|||
| XC6SLX9-2CSG324I | XILINX/赛灵思 |
BGA256 |
16+17+ |
78 |
||||
| S-8204BAS-TCT1U | 电源IC |
SEIKO/精工 |
TSSOP16 |
16+ |
6879 |
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